M888
M888 waterborne conformal coating is formulated from waterborne polyurethane resin, waterborne additives and deionised water. The agent has a very low odour, is non-flammable and non-explosive, safe and environmentally friendly. The film layer is bright, high gloss, strong adhesion, good flexibility and resistance to high and low temperature impact. It is suitable for the protection of various electronic and electrical components against moisture.
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Description
Intro
M888 waterborne conformal coating is formulated from waterborne polyurethane resin, waterborne additives and deionised water. The agent has a very low odour, is non-flammable and non-explosive, safe and environmentally friendly. The film layer is bright, high gloss, strong adhesion, good flexibility and resistance to high and low temperature impact. It is suitable for the protection of various electronic and electrical components against moisture.
General features
Color/Appearance | Milky white translucent liquid | |
Viscosity (25°C, S, Tu-4 cups) | 12-15 | |
thinner | Deionized water | |
drying time | Room temperature 30℃, 55%RH | Touch dry: 30-40min, hard work: 24 hours |
80℃ | Touch dry: <5min, hard work: 2-3 hours | |
Recommended best curing conditions | 60-80℃ for 3-5min, then curing at room temperature | |
Nonvolatile content (%) | 30±2 |
Electrical properties
Breakdown Strength (KV/mm) | ≥18 |
Volume resistivity (Ω.cm) | ≥1013 |
Chemical properties:
Neutral salt spray test (5%NaCl, 35±2℃), 48H | No foaming, no peeling, no whitening, no corrosion |
Moisture resistance ((MIL-46058C)) | ≥109Ω |
The above data are laboratory test data and are for reference only. In actual application, please refer to the actual test according to the specific requirements of different products
Storage: This product needs to be sealed and kept away from direct sunlight. It is recommended to store under the conditions of 5-35, and it is strictly forbidden to freeze.
user’s guidance
l Circuit board cleaning: It is recommended to clean the circuit board after assembly to remove dust, oil and post-soldering residues, which can effectively improve adhesion and prevent corrosion of components and solder joints.
l M888 is suitable for brushing, dipping and spraying. Users can adjust the viscosity and film thickness through deionization according to the coating process to achieve the best effect of their own process requirements.
l M888 is self-crosslinking and curing, the used product should not be returned to the original barrel, so as not to affect the stability of the product.
Remarks: If the residue is too high when used on the circuit board, it should be cleaned first, and then coated with moisture-proof agent, so as not to affect the adhesion and wetting performance.
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