CX200

CX200 is a halogen-free, lead-free flux with high activity and excellent performance in wave spray applications. It significantly reduces the generation of solder balls after wave spray and is suitable for less driable layout plating. Fluxed circuit boards have low post-solder residue, a clean appearance and bright, full solder joints.

Description

CX200 is a halogen-free, lead-free flux with high activity and excellent performance in wave spray applications. It significantly reduces the generation of solder balls after wave spray and is suitable for less driable layout plating. Fluxed circuit boards have low post-solder residue, a clean appearance and bright, full solder joints.

2、Product characteristics

Halogen free

Highly reactive

clean plate, no cleaning

Conforms to standard: ANSJ/J-STD-004

3、Operating instructions

Operating parameters SAC 305, Sn/Cu

Flux volume Spray: 200-220ug/cm2

Upper surface preheating temperature 105-110°C

Upper surface temperature max. ramp rate max. 2°C/sec

Track angle 5-8° (6° is the general recommendation)

Conveyor speed 1.0-1.6m/min

Contact time with solder 1.5-4.0 seconds (2-3 seconds is the general recommendation)

Solder bath temperature 255-270°C

Note: The above parameters are for reference only and are not guaranteed to give the best soldering results. In view of the varying conditions of the user’s equipment, components, boards etc., it is recommended that the user uses experimental design methods to obtain optimised parameters

  1. Physical properties

Item CX200 CX200A

Classification ORM0

Appearance Colourless transparent liquid Colourless to slightly yellow transparent liquid

Physical stability Pass: no stratification or crystallisation at 5±2°C, no stratification at 45±2°C

Solid content 3±0.5% 5.0±1.0%

Specific gravity (25℃) 0.805±0.010 0.806±0.010

Acid value 24.0±1.0mgKOH/g 25.0±2.0mgKOH/g

5、Reliability

Item Test result Test standard

Copper mirror corrosion Passed IPC-TM-650 2.3.32

Halogen content Pass EN14582

6、Surface insulation resistance

Test conditions Requirements Test results

IPC J-STD-004 Board side up, not cleaned >1.0*10^8 >1*10^9Ω

IPC J-STD-004 board side down, not cleaned >1.0*10^8 >2.0*10^9Ω

IPC J-STD-004 not cleaned >2.0*10^8 >5.0*10^9Ω

85℃,85%,RH,168hours/-50V,measuring voltage 100V,IPC-B-24 board,line spacing 0.5mm,line width 0.4mm

7、Cleaning after soldering

CX200 is a no-clean flux. No cleaning of post-soldering residues is required for general application.

If cleaning is required, the post-solder residue can be cleaned with the corresponding cleaning agent from Longline

Reviews

There are no reviews yet.


Be the first to review “CX200”