CX800
CX800 is a no-clean flux with a wide range of applicability and excellent performance in wave spray and manual dip soldering applications. The activity of the flux system is specially designed, so that even the printed circuit boards with general solderability and OSP process can obtain good soldering effect, especially suitable for lead-free process. Another feature of CX800 is that the circuit board after soldering has a high surface insulation resistance, which can ensure the reliability of the electrical performance of the circuit board.
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Description
Intro
CX800 is a no-clean flux with a wide range of applicability and excellent performance in wave spray and manual dip soldering applications. The activity of the flux system is specially designed, so that even the printed circuit boards with general solderability and OSP process can obtain good soldering effect, especially suitable for lead-free process. Another feature of CX800 is that the circuit board after soldering has a high surface insulation resistance, which can ensure the reliability of the electrical performance of the circuit board.
In the absence of special requirements, the cleaning process can be eliminated, thereby saving the manufacturer’s production costs.
CX800 has a large range of optional process parameters, so that it can adapt to different environments, different equipment and different application processes.
Product Features
● The surface of the solder joint has a slight gloss, which can be tested by bed of needles
● High wettability
● High surface insulation resistance
● Less residue and evenly assisted on the board, no cleaning
● Compliant with the standard: J-STD-004
operating instructions
| project | Recommended parameters |
| Flux coating amount | Spray process: 120-230μg/cm2 |
| board preheat temperature | 85-105℃ |
| Plate heating rate | Maximum 2℃/S |
| Belt inclination angle | 5-7° (6° is a general recommendation) |
| conveyor belt speed | 1.0-1.5m/min， |
| cross peak time | 1.5-3.5 seconds (usually 2.0-2.5 seconds) |
| Tin furnace temperature | 245-265℃ |
| Note: The above parameters are for reference only and cannot guarantee the best welding effect. In view of the different conditions of the user’s equipment, components, circuit boards, etc., it is recommended that the user adopt the design of experiments method to obtain the optimized parameters. | |
physical properties
| project | Test Results |
| Exterior | light yellow transparent liquid |
| odor | Alcoholic taste |
| physical stability | Pass: no delamination or crystallization at 5±2℃, no delamination at 45±2℃ |
| solid content | 4.0±0.5% |
| Specific gravity (25℃) | 0.795±0.02 |
reliability performance
| project | Test Results | standard test |
| Water extract resistivity | pass through | JIS Z3197 |
| Copper mirror corrosion | pass through | IPC-TM-650 2.3.32 |
| AgCrO4 | pass through | IPC-TM-650 2.3.33 |
| halogen content | pass through | JIS Z3197 |
surface insulation resistance
| IPC-J-STD-004 board face up | >1.0×108Ω | >1.1×109Ω |
| IPC-J-STD-004 board face down | >1.0×108Ω | >1.0×109Ω |
| IPC-J-STD-004 Blank Board | >2.0×108Ω | >1.1×109Ω |
| 85℃, 85%RH, 168 hours/-50V, test voltage 100V, IPC—B-24, line spacing 0.5mm, line width 0.4mm | ||
Post-Solder Cleaning
• CX800 is a no-clean flux and generally does not require cleaning of post-solder residues.
• If the product has high requirements, it needs to be cleaned, and the residue after welding can be cleaned with the corresponding cleaning agent of Changxian Company.
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