CX200
CX200 is a halogen-free, lead-free flux with high activity and excellent performance in wave spray applications. It significantly reduces the generation of solder balls after wave spray and is suitable for less driable layout plating. Fluxed circuit boards have low post-solder residue, a clean appearance and bright, full solder joints.
- Description
- Reviews (0)
Description
CX200 is a halogen-free, lead-free flux with high activity and excellent performance in wave spray applications. It significantly reduces the generation of solder balls after wave spray and is suitable for less driable layout plating. Fluxed circuit boards have low post-solder residue, a clean appearance and bright, full solder joints.
2、Product characteristics
Halogen free
Highly reactive
clean plate, no cleaning
Conforms to standard: ANSJ/J-STD-004
3、Operating instructions
Operating parameters SAC 305, Sn/Cu
Flux volume Spray: 200-220ug/cm2
Upper surface preheating temperature 105-110°C
Upper surface temperature max. ramp rate max. 2°C/sec
Track angle 5-8° (6° is the general recommendation)
Conveyor speed 1.0-1.6m/min
Contact time with solder 1.5-4.0 seconds (2-3 seconds is the general recommendation)
Solder bath temperature 255-270°C
Note: The above parameters are for reference only and are not guaranteed to give the best soldering results. In view of the varying conditions of the user’s equipment, components, boards etc., it is recommended that the user uses experimental design methods to obtain optimised parameters
- Physical properties
Item CX200 CX200A
Classification ORM0
Appearance Colourless transparent liquid Colourless to slightly yellow transparent liquid
Physical stability Pass: no stratification or crystallisation at 5±2°C, no stratification at 45±2°C
Solid content 3±0.5% 5.0±1.0%
Specific gravity (25℃) 0.805±0.010 0.806±0.010
Acid value 24.0±1.0mgKOH/g 25.0±2.0mgKOH/g
5、Reliability
Item Test result Test standard
Copper mirror corrosion Passed IPC-TM-650 2.3.32
Halogen content Pass EN14582
6、Surface insulation resistance
Test conditions Requirements Test results
IPC J-STD-004 Board side up, not cleaned >1.0*10^8 >1*10^9Ω
IPC J-STD-004 board side down, not cleaned >1.0*10^8 >2.0*10^9Ω
IPC J-STD-004 not cleaned >2.0*10^8 >5.0*10^9Ω
85℃,85%,RH,168hours/-50V,measuring voltage 100V,IPC-B-24 board,line spacing 0.5mm,line width 0.4mm
7、Cleaning after soldering
CX200 is a no-clean flux. No cleaning of post-soldering residues is required for general application.
If cleaning is required, the post-solder residue can be cleaned with the corresponding cleaning agent from Longline
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