CX400
CX400 lead-free no-clean flux for spray wave soldering, suitable for single and dual wave soldering. It eliminates the need for cleaning and thus saves the manufacturer’s production costs when there are no special requirements. It is widely used in computer peripherals, LEDs and products with high requirements for the post-solder surface.
- Description
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Description
INTRO
CX400 lead-free no-clean flux for spray wave soldering, suitable for single and dual wave soldering. It eliminates the need for cleaning and thus saves the manufacturer’s production costs when there are no special requirements. It is widely used in computer peripherals, LEDs and products with high requirements for the post-solder surface.
- Product Features
- Solder joints are uniform and bright (matte) to avoid eye fatigue
- Good wetting, good leveling
- Less residue after welding, the board surface is clean, can meet the needle bed test, and can be cleaned after welding
- J-STD-004
- Operation guide
| Operating parameters | BAG 305 |
| Flux amount | Spray: 150-220 µg/c for double peaks and 80-130 µg / cm 2 for single peaks |
| Upper surface preheat temperature | 90-105°C |
| Lower surface preheat temperature | 35°C higher than top surface |
| The maximum heating slope of the upper surface temperature | 2″c/sec max |
| Orbit angle | 5-8° (6° is a general recommendation) |
| conveyor belt speed | 0.9-1.8 m/min |
| Contact time with solder | 1.5-3.5 seconds |
| Solder bath temperature | 255—265°C |
| Note: The above parameters are for reference only and cannot guarantee the best welding effect. The user’s equipment, components, circuit boards and other conditions are different, and the user is recommended to use the experimental design method to obtain the optimized parameters | |
- Physical properties
| project | Test Results |
| Exterior | Colorless transparent liquid |
| odor | Alcoholic taste |
| physical stability | Pass: 5±2°C without delamination or crystallization, 45±2°C without delamination |
| solid content | 2.5±0.5% |
| Specific Gravity ( 25°C ) | 0.795 soil 0.010 |
| Acid value | 18±1.0mgKOH/g |
- Reliability performance
| project | Test Results | standard test |
| Water extract resistivity | pass through | JIS Z3197 |
| Copper mirror corrosion | pass through | IPC-TM-650 2.3.32 |
| AgCr04 | pass through | IPC-TM-650 2.3.33 |
| halogen content | pass through | JIS Z3197 |
- Surface insulation resistance
| Test Conditions | Require | Test Results |
| IPC J-STD-004 Board face up, not cleaned | > 1.0 X 10Ω | > 1.1 x 10Ω |
| IPC J-STD-004 Board face down, not cleaned | > 1.0 X 10Ω | >1.9 X 10Ω |
| IPC J- STD- 004 Blank Board | >2.0 X 10Ω | > 5.3 x 10Ω |
| 85°C, 85% RH, 50V for 168 hours, measuring voltage 1OOV, IPC-8-24 board, line spacing 0.5mm, line width 0.4mm | ||
- Cleaning after welding
- CX400 is a no-clean flux. Post-solder residue cleaning is not required for general application.
- If cleaning is required, the residue after welding can be cleaned with the corresponding cleaning agent of Changxian Company.
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